SILVER-FREE, LEAD-FREE SOLDER 500g Φ1.0mm｜Lead-Free Solders｜Soldering Work Materials｜Products

SILVER-FREE, LEAD-FREE SOLDER 500g Φ1.0mm
SF-C50010

Professional-use 500g roll series of silver-free, lead-free solder.

Package Contents

Features

Specifications

Replacement Tips

Replacement Parts

Silver-free, Lead-free Solder Series

Wire dia.: Φ1.0mm, 500g roll for professional use.

Rosin-cored. Recommended for electronic components, e.g. insertion parts or surface mounting.

*SF-C-50016N requires flux for sheet metal or stainless steel. (Sold separately)

Features of Silver-free Solder

It is a silver-free, lead-free solder made of tin, copper, nickel, and germanium.

Excellent Wettability

Excellent in wetting and spreading of solder. Forms beautiful fillets.

Suppresses Copper Corrosion

The barrier effect of nickel suppresses copper corrosion of patterns and wires.
Minimizing corrosion on the copper land improves reliability after jointing.

Suppresses Shrinkage Cavities

The nickel effect, which refines the compound, suppresses shrinkage cavities and forms smooth fillets.

Stable Alloy Layer

A stable alloy layer is formed at the interface of copper foil and solder on the substrate.
The barrier effect of nickel also suppresses the growth of the alloy layer.

Introduction of Silver-free, Lead-free Solder Series

<Professional use 500g> Wire Φ0.6mm - 1.6mm

<Professional use 70g> Wire Φ0.6mm - 1.6mm

<Hobby use in small amount> Wire Φ0.6 mm - 1.6 mm

Product Specifications

Model	Dia.	Composition	M.T.	Weight (reference)	Rosin
SF-C50006	φ0.6mm	Other–0.7–0.05–≤0.01% （Sn-Cu-Ni-Ge）	227℃	約500g	Rosin Core
SF-C50008	φ0.8mm
SF-C50010	φ1.0mm
SF-C50012	φ1.2mm
SF-C50016	φ1.6mm
SF-C50016N※	φ1.6mm				None