• RoHS2
  • LEAD FREE

SILVER-FREE, LEAD-FREE SOLDER FOR PCBs Φ1.0mm
SD-301

Silver-free, Lead-free Solder

Package Contents

Silver-free, Lead-free Solder Series

Small Amount of Silver-free, Lead-free Solder, approx. 0.8 m length.

Silver-free, lead-free solder with flux for ease of use. (Spiral solder φ1.0mm)

Small package is good for small jobs, easy to carry.

Features of Silver-free Solder

It is a silver-free, lead-free solder made of tin, copper, nickel, and germanium.

Excellent Wettability

Excellent in wetting and spreading of solder. Forms beautiful fillets.

Suppresses Copper Corrosion

The barrier effect of nickel suppresses copper corrosion of patterns and wires.
Minimizing corrosion on the copper land improves reliability after jointing.

Suppresses Shrinkage Cavities

The nickel effect, which refines the compound, suppresses shrinkage cavities and forms smooth fillets.

Stable Alloy Layer

A stable alloy layer is formed at the interface of copper foil and solder on the substrate.
The barrier effect of nickel also suppresses the growth of the alloy layer.

Introduction of Silver-free, Lead-free Solder Series

<Professional use 500g> Wire Φ0.6mm - 1.6mm

<Professional use 70g> Wire Φ0.6mm - 1.6mm

<Hobby use in small amount> Wire Φ0.6 mm - 1.6 mm

Product Specifications

Model Dia. Composition（Sn-Cu-Ni-Ge） M.T. Weight (reference) Rosin
SD-301 φ1.0mm Other–0.7–0.05–≤0.01% 227℃ 3g Rosin Core

 

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