SILVER-FREE, LEAD-FREE SOLDER 500g Φ0.8mm
SF-C50008
Professional-use 500g roll series of silver-free, lead-free solder.
Package Contents |
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Silver-free, Lead-free Solder Series
Wire dia.: Φ0.8mm, 500g roll for professional use.
Rosin-cored. Recommended for electronic components, e.g. insertion parts or surface mounting.
*SF-C-50016N requires flux for sheet metal or stainless steel. (Sold separately)
Features of Silver-free Solder
It is a silver-free, lead-free solder made of tin, copper, nickel, and germanium.
Excellent Wettability
Excellent in wetting and spreading of solder. Forms beautiful fillets.
Suppresses Copper Corrosion
The barrier effect of nickel suppresses copper corrosion of patterns and wires.
Minimizing corrosion on the copper land improves reliability after jointing.
Suppresses Shrinkage Cavities
The nickel effect, which refines the compound, suppresses shrinkage cavities and forms smooth fillets.
Stable Alloy Layer
A stable alloy layer is formed at the interface of copper foil and solder on the substrate.
The barrier effect of nickel also suppresses the growth of the alloy layer.
Introduction of Silver-free, Lead-free Solder Series
<Professional use 500g> Wire Φ0.6mm - 1.6mm
<Professional use 70g> Wire Φ0.6mm - 1.6mm
<Hobby use in small amount> Wire Φ0.6 mm - 1.6 mm
Product Specifications
Model | Dia. | Composition | M.T. | Weight (reference) | Rosin |
SF-C50006 | φ0.6mm | Other–0.7–0.05–≤0.01% (Sn-Cu-Ni-Ge) |
227℃ | 約500g | Rosin Core |
SF-C50008 | φ0.8mm | ||||
SF-C50010 | φ1.0mm | ||||
SF-C50012 | φ1.2mm | ||||
SF-C50016 | φ1.6mm | ||||
SF-C50016N※ | φ1.6mm | None |
*SF-C-50016N requires flux for sheet metal or stainless steel. (Sold separately)
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